CL-583 High-Temperature Polyimide Labels for PCB Traceability

This label material is intended for identification, process control and product traceability in electronics manufacturing, particularly on printed circuit boards and sensitive components. Its matte white coating supports printing, while the polyimide base and acrylic adhesive define the material construction available for selection. The stated 1mil thickness is not identified as total construction thickness including adhesive.

Reflow soldering and wave soldering are listed applications. The stated temperature resistance range does not include a matching dwell time or number of cycles, so it should not be interpreted as a continuous service rating. As a general selection precaution, evaluate samples at the intended label position using the actual peak temperature, exposure time and complete process sequence.

Chemical solvent resistance is stated, but no solvent identities or test conditions are provided. For a cleaning process, confirm the cleaning agent, concentration, temperature and exposure conditions, then assess label adhesion, surface condition and printed readability. Printing equipment and ribbon compatibility are not specified. Use on sensitive components does not establish electrostatic discharge (ESD) protection.

The external product data lists SGS/UL/RoHS under certification standards. This preserves the supplied specification wording; it is not a claim that our company or this model holds verified certification. Request the applicable documentation and confirm its product coverage and conditions before using these entries as an approval requirement.